发明名称 |
Electronic component package with decoupling capacitors completely within die receiving cavity of substrate |
摘要 |
An electronic component package comprising a substrate having at least one die-receiving cavity formed therein, the cavity being defined by a die-receiving surface and an inner sidewall having a terraced contour, the substrate having an exterior surface bordering the cavity perimeter, the inner sidewall extending between the die-receiving surface and the substrate exterior surface, and at least one capacitor positioned completely within the cavity and mounted to the terraced contour of the inner sidewall.
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申请公布号 |
US5831810(A) |
申请公布日期 |
1998.11.03 |
申请号 |
US19960701029 |
申请日期 |
1996.08.21 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BIRD, KENNETH A.;BROFMAN, PETER J.;CAPPO, JR., FRANCIS F.;FRANKEL, JASON L.;KADAKIA, SURESH D.;KNICKERBOCKER, SARAH HUFFSMITH;SIKORSKI, SCOTT A. |
分类号 |
H01L23/12;H01L23/13;H01L23/64;(IPC1-7):H01G4/00 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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