| 摘要 |
A heat transfer apparatus is carried on a substrate (204) having top and bottom surfaces (212, 214). The heat transfer apparatus includes a pad (220/222), at least one via (224/226), and a plurality of pads (302). The pad (220/222) is carried on the top surface (212) of the substrate (204) to electrically connect to an electronic component (228/230). The via (224/226) intersects the pad (220/222) and extends between the top and bottom surfaces (212, 214) of the substrate (204). The plurality of pads (302) are carried on the bottom surface (214) of the substrate (204) beneath the pad (220/222). The via (224/226) intersects one of the plurality of pads (302) to transfer heat generated during operation of the electronic component (228/230) thereto.
|
