发明名称 Method for etching aluminum metal films
摘要 A mixed etching gas consisting of boron trichloride, a rare gas, and chlorine is used for etching of an aluminum metal film by dry-etching. In the first step, high frequency power is used to etch and remove alloy grains which tend to form residues and to etch an aluminum metal film in an anisotropic mode. Just before the under-layered silicon film is exposed, the frequency power is lowered but is kept higher than the minimum power required for anisotropic etching to enable etching selectivity with respect to the silicon dioxide film to be achieved.
申请公布号 US5827436(A) 申请公布日期 1998.10.27
申请号 US19960616964 申请日期 1996.03.15
申请人 SONY CORPORATION 发明人 KAMIDE, YUKIHIRO;TAKAOKA, YUJI;YAMAMICHI, YASUAKI
分类号 C23F4/00;H01L21/302;H01L21/3065;H01L21/3213;(IPC1-7):C23F1/20;H01L21/00 主分类号 C23F4/00
代理机构 代理人
主权项
地址