SEMICONDUCTOR SEALING METHOD

摘要

PROBLEM TO BE SOLVED: To make feasible more stable continuous molding by a method wherein a wire bonded lead frame or a lead wire junctioned with a semiconductor element are inserted into an injection metallic mold to be fixed so as to inject and set an epoxy resin sealing material using an injection unit. SOLUTION: A plunger pot injecting tablets in a metallic mold in the case of transfer molding is substituted with an injection molding system composed of a hopper feeding powder or granulated powder, an injection unit 15 having a screw cylinder measuring and evenly kneading the material to be injected into a metallic mold 29 forming a semiconductor molded product and a clamping unit 21 for driving-control the material by hydraulic and motor-driven servo mechanism. The injection pressure is relatively low especially preferable in the pressure holding stage. Besides, the heating cylinder divided into multiple zones respectively controls the temperature at an agreeable level independently. In such a constitution, the injection pressure in the low pressure region, the injection speed in very low rate region and the temperature can be easily controlled thereby making feasible semiconductor sealing by the injection molding.