发明名称 Integrated circuit heat sink with rotatable heat pipe
摘要 An apparatus is a heat conducting connection between a heat pipe and a structure such as an integrated circuit heat sink. The heat sink contains a groove with extension tabs protruding above edges of the groove so that the tabs can be bent over to hold the heat pipe in the groove which is dimensioned to give a clearance space around the heat pipe. When the tabs are bent down far enough to deform the heat pipe or a heat conductive hardening material is used to fill the clearance space, the heat pipe is fixed in place. If the tabs are bent down to barely contact the heat pipe and a heat conductive non-hardening material is used to fill the clearance space, the heat pipe can still be rotated within the groove.
申请公布号 US5826645(A) 申请公布日期 1998.10.27
申请号 US19970844811 申请日期 1997.04.23
申请人 THERMAL CORP. 发明人 MEYER, IV, GEORGE A.;TOTH, JEROME E.
分类号 F28D15/02;H01L23/427;(IPC1-7):F28D15/00 主分类号 F28D15/02
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