| 摘要 |
1,043,892. Semi-conductor devices. SIEMENS-SCHUCKERTWERKE A.G. April 26, 1963 [April 28, 1962], No. 16615/63. Heading H1K. A semi-conductor device comprises a sealed housing containing a stem member with headpiece at one end which is urged into non-bonded contact relationship with the semi-conductor body, an auxiliary connecting member being located between the body and the head-piece so that it contacts a peripheral portion on the head-piece which is yieldable so as to absorb dimensional changes due to thermal expansion. In the embodiment, which shows a semiconductor device sealed in copper cup member 1, the semi-conductor member 7 is lodged between silver plate layers 8, 8a. Saddle-shaped sheet metal spring 26 urges insulator member 21 against the periphery of head-piece 12 on electrode stem 11 to press auxiliary contact member 9 against the semi-conductor. A recess 10 is provided in member 9 so that movement of member 9 relative to stem 11 is possible due to yielding of head-piece 12. In other examples, the recess is provided in head-piece 12 or alternatively, by spacing rings, and head-piece 12 may consist of a corrugated disc. |
