发明名称 |
Device for turning a wafer during a wet etching process |
摘要 |
A wet etching device used in manufacturing a semiconductor device includes a power source, a transmission device for transmitting power from the power source, and a roller for reversing top and bottom positions of a wafer placed in a processing bath using power from the power source transmitted by the transmission device. Here, the initial top and bottom positions of the wafer during loading are reversed before unloading. Accordingly, the entire surface of the wafer spends an equal amount of time in the processing bath containing a chemical solution and can thus be etched uniformly.
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申请公布号 |
US5827396(A) |
申请公布日期 |
1998.10.27 |
申请号 |
US19960773059 |
申请日期 |
1996.12.24 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KO, SE-JONG;JEON, PYEONG-SIK;YUN, YOUNG-HWAN;MOON, SANG-YOUNG |
分类号 |
H01L21/683;H01L21/00;H01L21/306;(IPC1-7):C23F1/00;C03C25/06 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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