| 摘要 |
<p>PROBLEM TO BE SOLVED: To expand a chip interval with no expansion by pasting a to-be-cut object to an adhesive sheet comprising a contraction film, an expandable film, and an adhesive agent layer, fixing an end part of the adhesive sheet, dicing the to-be-cut object, and contracting the contraction film. SOLUTION: Relating to a chip body manufacturing adhesive sheet 10, a contraction film 2 is laminated over the entire surface of an expandable film 4 through a bonding agent layer 3, and a to-be-cut/pasting adhesive agent layer 1 is provided on the entire surface of the contraction film 2. An end part of the chip body manufacturing/adhesive sheet 10 is, at an upper periphery part of a to-be-cut object pasting adhesive agent layer 1, fixed with a ring frame 5, and a to-be-cut object 6 is pasted to an upper inside periphery part of the to-be-cut object adhesive agent layer 1. As the to-be-cut object 6, such thing as a semiconductor is mounted on a lead frame is listed. An elastic modulus of the expandable film is preferred to be less than 1×10<9> N/m<2> , while a radiation setting type adhesive agent is preferable for the adhesive agent layer 1.</p> |
