发明名称 |
Microencapsulatable solvent adhesive composition and method for coupling conduits |
摘要 |
A microencapsulatable solvent adhesive composition for coupling plastic conduits, such as pipes, connectors and related fittings comprises a water-insoluble polymer and a mixture of volatile organic solvents for the polymer, each of the solvents having 6 to 40 carbon atoms. This solvent adhesive composition is suitable for microencapsulation by aqueous-based microencapsulation processes. A plurality of microcapsules encapsulating the solvent adhesive composition are bound to a polymeric surface of a conduit, such as a pipe connector or fitting, by a binder composition, to form a surface coated with a layer of rupturable microcapsules. When the microcapsules are ruptured upon joining of the coated conduit to a second conduit, the volume of the released solvent adhesive composition is sufficient to cement the surfaces together.
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申请公布号 |
US5824724(A) |
申请公布日期 |
1998.10.20 |
申请号 |
US19980009106 |
申请日期 |
1998.01.20 |
申请人 |
THE LAMSON & SESSIONS CO. |
发明人 |
ROESCH, MARK A.;MACCARONE, DAVID A.;HILLENBRAND, GARY F.;NEWSOM, MORRIS F.;LYNCH, ROLAND M. |
分类号 |
C09J9/00;C09J11/00;C09J127/06;F16L13/10;(IPC1-7):C08K9/10 |
主分类号 |
C09J9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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