A fuseless memory repair system and method of operation

摘要

The system uses circular-coupled inverters (208,210) for redundant row selection instead of conventional fuses. An on-chip test controller is capable of testing memory rows either at wafer probe, at final testing after manufacturing, or after memory chip packaging. If this testing identifies faulty memory rows, the inverters can be internally re-programmed to create a new memory configuration which includes redundant rows. The inverters can be re-programmed at a later time to a new configuration containing more or less redundant rows/columns as required.