| 摘要 |
A travelling thermocouple dynamically profiles the actual temperature of a substrate passing through a vertical oven without entangling the thermocouple wires. Media components, such as microprocessor chips in a semiconductor wafer, are supported on a tray or plate on a driven conveyor. A thermocouple formed of two metal wires of extended length are connected at one end to the media component and at the other end to a stationary readout device and function as the temperature gauge for all trays of components passing through the oven. A C-shaped clamp or hook secured to the thermocouple wires resiliently engages a chain drive driven independently of the conveyor drive but in correlation therewith by a computer controller and pulls the wires through the oven keeping pace with the media component to which it is attached. When turning the corners at the top of the oven the hook is crossed over from the leading end of the plate to the trailing end of the plate by effecting temporary relative motion between the drives. The wires are guided in a G-shaped channel throughout their passage in the oven. After exiting the oven, the hook is disconnected from the chain, and the wires are pulled forwardly through the oven after being disconnected from the readout device for reuse in another pass. An alternate embodiment is in a horizontal oven which includes going around corners.
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