发明名称 EPOXY RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a composition which can be used for producing a cured epoxy resin having not only excellent electrical insulating properties and mechanical properties, which are inherent to an epoxy resin, but also excellent adhesiveness with a plastic and a high glass transition temperature, by compounding an epoxy resin, an acid anhydride, a cure accelerator and an amine type silane coupling agent. SOLUTION: (A) An epoxy resin usable is a bisphenol A type epoxy resin or the like which has one or more epoxy resins. (B) An acid anhydride usable is preferably a liquid at room temperature, such as methyltetrahydrophthalic anhydride. (C) As a cure accelerator, use is made of, for example, 2-ethyl-4- methylimidazole. (D) As an amine type silane coupling agent, use is made of, for example,γ-aminopropyltrimethoxysilance. Components B and D are preferably compounded in amounts of 70 to 130 pts.wt. and 0.5 to 5 pts.wt., respectively, relative to 100 pts.wt. of component A, and component C is preferably compounded in amounts of 0.1 to 5 pts.wt. relative to 100 pts.wt. of component B.
申请公布号 JPH10273519(A) 申请公布日期 1998.10.13
申请号 JP19970076799 申请日期 1997.03.28
申请人 HITACHI CHEM CO LTD 发明人 YASU KATSUHIKO;FUJITA TOSHIYUKI
分类号 C08L63/00;C08G59/42;C08G59/58;H01B3/40;(IPC1-7):C08G59/42 主分类号 C08L63/00
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