发明名称 |
Imager package substrate |
摘要 |
An image head assembly comprising: a substrate with at least a pair of apertures formed in the substrate; an optical assembly having at least a pair of pins that mate with the apertures within the substrate, the pins to the optical assembly being fixedly secured to the apertures within the substrate; an image sensor located between the apertures covered by a cover glass above the image sensor on the optical assembly; interface means for providing an electrical connection between the substrate and the image sensor; a lens system mounted on top the cover glass; and a single element blur filter contained within the lens system. The assembly contains a single element blur filter such as a cross-pleated blur filter. The lens system is prevented from being a reverse telephoto lens system with use of a blur filter that does not require a large back focus and is instead a telephoto lens system.
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申请公布号 |
US5821532(A) |
申请公布日期 |
1998.10.13 |
申请号 |
US19970876633 |
申请日期 |
1997.06.16 |
申请人 |
EASTMAN KODAK COMPANY |
发明人 |
BEAMAN, BRYAN A.;GERSTENBERGER, JULIE K.;ORLICKI, DAVID M. |
分类号 |
H01L27/14;H01L31/0203;H04N5/225;H04N5/369;(IPC1-7):H01J5/02 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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