发明名称 PACKAGING BOARD TESTING JIG SPOT FACING WORK SYSTEM
摘要 PROBLEM TO BE SOLVED: To enable an application of the test of a testing jig early from the first of the production of a packaging board by a method wherein data on a spot facing work defining the specification of an area, which is subjected to spot facing work which is performed on the jig, is outputted on the basis of data inputted on the design of the board, data on the position of a probe and data on the margin of the area, which is subjected to spot facing work. SOLUTION: Data on the arrangement of components of data 1 on the design of a board and data on the shapes of the components are inputted according to the case where a conventional packaging board is actually measured to calculate the range of an area, which is subjected to spot facing work, on a jig base. Moreover, data on the height of the area, which is subjected to spot facing work, is calculated on the basis of data on the heights of the components of the data 1 and at this time, a prescribed margin is added to data on the area, which is subjected to spot facing work, on the basis of data 3 on the margin of the area and data 5 on a spot facing work is generated. A processing for modifying the area, which is subjected to spot facing work, is performed so that the data 5, which is generated, on the spot facing work, the position of a probe and the necessary thickness of the wall of the probe can be ensured and the data 5 subsequent to the modification of the area is generated to output the data 5.
申请公布号 JPH10275970(A) 申请公布日期 1998.10.13
申请号 JP19970080476 申请日期 1997.03.31
申请人 MITSUBISHI ELECTRIC CORP 发明人 YAMAZAKI HIDEYO
分类号 G01R31/02;G01R31/28;H05K3/00;H05K13/08 主分类号 G01R31/02
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