| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooler in which a semiconductor element is pressed uniformly and the cooling function is exhibited efficiently and thereby the electric characteristics of the semiconductor element are stabilized and the reliability thereof is enhanced. SOLUTION: The cooler 20 comprises a cooling block 22 and a cover block 23. The cooling block 22 is provided with trenches 24 and cooling fin parts 25 on one side face thereof. Water channels are formed at the joint face part between the cooling block 22 and the cover block 23. The other side face of the cooling block 22 is a plane 32 to which a semiconductor element 34 is brought into pressure contact. A groove 26 is made continuously in the outer circumferential part of the joint face of the cooling block 22 along the circumferential direction. A protrusion 27 to be fitted tightly in the groove 26 is made continuously in the outer circumferential part of the joint face of the cover block 23 along the circumferential direction. |
