SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To reduce a chip layout area of an input protection circuit and improve surge resistance. SOLUTION: A conductive line 1 is arranged in an upper layer of an input protection circuit IPC electrically connected to a pad PD to cover at least a part thereof. The conductive line 1 is wide enough to disperse and absorb heat generated from the input protection circuit IPC. Since the device has a region wherein the input protection circuit IPC and a plane layout of the conductive line overlap each other, it is possible to effectively reduce a chip layout area of the input protection circuit IPC and to prevent heat breakdown of the input protection circuit IPC, thus improving surge resistance.