| 摘要 |
PROBLEM TO BE SOLVED: To reduce the transient thermal resistance at once and improve the mean thermal conductivity and thermal reliability, by using a gradient functional material made member having a metal compsn. constructing a heat sink and its base and ceramic compsn. integrally constructing a ceramic insulation board. SOLUTION: The semiconductor circuit board 10 has a gradient functional material member 12 and semiconductor circuit 14 thereon. The member 12 is composed of a metal layer 16 forming a heat sink, ceramic layer 18 forming a ceramic insulation board, and composite layer 20 disposed at the boundary of the metal and ceramic layers 16, 18 in an integral form. The circuit board 10 has the Cu-W alloy layer 16 integrated with the member 12 as a heat sink and hence no solder junction to be a boundary thermal conduction, thereby utterly reducing the heat transfer resistance to increase the means thermal conductivity about twice. |
