发明名称 TRANSFER OF LEAD FRAME
摘要 PROBLEM TO BE SOLVED: To provide a method for transferring various types of lead frames in their optimum condition according to their lengths and widths for their later smooth treatments. SOLUTION: In the method, transfer of a lead frame P in its width direction from a die bonder 1 to a magazine transfer device 4 is controlled based on a central axis of the lead frame P according to the full length and width of the lead frame P obtained from information of the frame P. Transfer of the lead frame in its length direction is controlled according to the array condition of a lead frame transfer means 2 provided in a cure device 3 and the full length of the frame P.
申请公布号 JPH10270473(A) 申请公布日期 1998.10.09
申请号 JP19970071468 申请日期 1997.03.25
申请人 NIPPON SANSO KK;SHINKU RAITO:KK 发明人 ECHIGOSHIMA MAKOTO;KIMOTO TAKESHI
分类号 H05K13/02;H01L21/50 主分类号 H05K13/02
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