| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame in which cutting of the tie bar can be prevented from being shifted due to uneven pitch shrinkage after resin sealing. SOLUTION: A plurality of slits 3 are made, while being divided by a sufficiently deformable support 4, around a semiconductor device constituting part 2 formed on a lead frame 1. Since the slit 3 is filled with a resin material 6 at least the part intersecting a runner part 5, resin sealing can be carried out while preventing leakage through the slit 3 and the stress acting on the four corners of a package after resin sealing can be made uniform. Consequently, uneven pitch shrink can be prevented. |
