| 发明名称 |
Method of mounting components on a printed circuit board |
| 摘要 |
<p>The present invention provides a method of making a printed circuit board assembly. The method includes the steps of applying a solder paste (62) to a substrate (42) and partially filling vias (44) in the substrate (42) and assembling electrical components (54) thereto. The method further includes heating the printed circuit board (40) to cause the solder paste (62) to reflow and then cooling the printed circuit board (44). <IMAGE></p> |
| 申请公布号 |
EP0869704(A1) |
申请公布日期 |
1998.10.07 |
| 申请号 |
EP19970310707 |
申请日期 |
1997.12.31 |
| 申请人 |
FORD MOTOR COMPANY |
发明人 |
CARDELLINO, TERRI ANN;FORD, DOUGLAS MONTGOMERY;DAVIS, RUSSELL WILLIAM |
| 分类号 |
H05K1/02;H05K3/34;H05K3/42;(IPC1-7):H05K3/34 |
主分类号 |
H05K1/02 |
| 代理机构 |
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