发明名称 |
Resin-sealed wireless bonded semiconductor device |
摘要 |
A bonding structure of a semiconductor chip to a substrate comprises both a bonding portion including at least an aluminum-containing electrode formed on the semiconductor chip and a gold-containing electrically conductive bump on the aluminum-containing electrode, wherein the bonding portion further includes Pd and Cu. <IMAGE> |
申请公布号 |
EP0869548(A1) |
申请公布日期 |
1998.10.07 |
申请号 |
EP19980105868 |
申请日期 |
1998.03.31 |
申请人 |
NEC CORPORATION |
发明人 |
SUZUKI, KOUICHI;SATO, SADANOBU;YAMASHITA, YUMIKO |
分类号 |
H01L21/60;H01L21/56;H01L23/485 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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