| 摘要 |
PROBLEM TO BE SOLVED: To obtain a sealing resin which can easily and sufficiently reduce the thermal stress of a metal bump without a rise in cost by dispersing a filler having a void and an apparent density substantially equal to that of the resin component in the resin component which is substantially liquid in an uncured state and to obtain a semiconductor device sealed therewith. SOLUTION: A filler 9 has a void 10 in its inside and has a true density, which is the density of the part except the void, of D0 g/cm<3> and an apparent density, which is the density of the filler including the void, of D g/cm (<D0 ) and is nearly the same as that of the resin component. In a semiconductor device sealed with a resin having a moving rate of a filler 9 of substantially 0, a sealing resin 7 is packed into the part outside a solder 6 between a semiconductor element 4 and a substrate 5 and is cured to protect the surface of the element 4. The resin 7 comprises a resin component 8 being an epoxy resin having a viscosity r of 10 P, a curing time t of 600 s and a densityρof 1.2 g/cm<3> and a spherical filler 9 having a radius a of 5μm and having a void 10 in its inside and dispersed in the component 8.
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