发明名称 |
Method of fabricating electronic circuit device and apparatus for performing the same method |
摘要 |
An apparatus comprises a sputter cleaning device, an alignment device operable in atmospheric condition and a heating and soldering device in the form of a belt furnace operable in non-oxidizing or reducing environment. Instead of the sputter cleaning device, a mechanical polishing or cutting device can be used to clean a surface of solder or a member to be bonded or a solder ball plated with gold may be used. An alignment between two members to be bonded is provided by an alignment mark means which comprises a protrusion on a surface of one member and a complimentary recess formed at a center portion of a protrusion means formed on a corresponding surface of the other member.
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申请公布号 |
US5816473(A) |
申请公布日期 |
1998.10.06 |
申请号 |
US19950578054 |
申请日期 |
1995.12.22 |
申请人 |
HITACHI, LTD. |
发明人 |
NISHIKAWA, TORU;SATOH, RYOHEI;HARADA, MASAHIDE;HAYASHIDA, TETSUYA;SHIRAI, MITUGU |
分类号 |
B23K1/00;B23K1/008;B23K1/20;H01L21/48;H01L21/56;H01L21/60;H01L21/68;H01L23/498;H05K3/34;(IPC1-7):H05K3/34 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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