| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed circuit board which can be improved in flexural strength. SOLUTION: A multilayer printed circuit board 10 is constituted of a substrate 11 which is formed by laminating a plurality of ceramic dielectric sheets 11a-11d upon another, outer electrodes 12 which are formed so that the electrodes 12 may be protruded to the backside of the substrate 11, mounting electrodes 13 which are formed on the backside of the substrate 11 and respectively connected to the outer electrodes 12, and a circuit pattern 14 formed on the surface of the substrate 11. The conductor patterns 15 on the dielectric sheets 11a-11d are connected to each other through via hole electrodes 16. The outer electrodes 12 are formed by extending the via hole electrodes 16 which are formed in the lowest dielectric sheet 11a toward the backside of the substrate 11 from the inside of the substrate 11 and protruding the electrodes 16 to the backside of the substrate 11. In addition, electronic parts 17 are connected to the circuit pattern 14 formed on the surface of the substrate 11 by soldering. |
