Low temperature method for mounting electrical components

摘要

A method for low temperature attachment of components is provided which uses an electrically conductive adhesive. The electrically conductive adhesive may be defined by a substrate having numerous passageways through the substrate. The passageways are defined by a plurality of walls of the material making up the substrate. The walls are covered with a layer of conductive metal. The passageways at the outer surfaces are filled with a non-conductive pressure sensitive adhesive resin.