| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a flexible wiring board with no missing of a copper conductor part resulting from a pin hole generated when a base material metal layer is formed on an insulator film by a dry plating process while tight-contact characteristics between the insulator film and the base material metal layer is excellent. SOLUTION: On an insulator film, a base material metal layer comprising a coated layer which is formed by a dry plating method using at least one kind selected among nickel, copper-nickel alloy, chromium, and chromium oxide and a copper coat layer formed over it bu a dry plating method is formed. Then on the base material metal layer, a primary electric copper plating coat layer id formed, then, it is treated in an inorganic alkali solution, organic alkali solution, or a mixed solution of them, then on the primary electric copper plating coat layer, an electroless copper plating coat is formed, and lastly, the secondary electric copper plating coat layer is formed, eventually a copper conductor layer of 1-35μm thickness is formed on an insulator film.
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