| 摘要 |
PROBLEM TO BE SOLVED: To facilitate mounting of an electronic component onto a high density mounting board by making the nozzle part of an electronic device holder and a solder fusion unit turnable, respectively about a vertical axis thereof thereby adjusting the rotational angle of each nozzle part independently. SOLUTION: An electronic component holder 5 comprises a pickup pipe 20 provided with a pickup nozzle 19 at the lower end part thereof, and a pickup box 27 interposed between the pickup pipe 20 and a pickup bracket 21. The pickup box 27 is supported rotatably, with respect to the pickup bracket 21 and the rotational angle of a pickup nozzle 19, which turns integrally with the pickup box 27, is finely adjusted independently. The reflow nozzle 37 of a solder fusion unit 6 is supported rotatably through a bearing 45 with respect to a reflow box 38, and the rotational angle thereof is finely adjusted independently. |
