WAFER WITH LASER MARK

摘要

PROBLEM TO BE SOLVED: To easily judge the crystal orientation and specification of a wafer, without influencing the residual machining strain or thermal stress thereon, by finishing the marginal chamfered part of the wafer in a mirror surface, and engraving crystal orientation judging laser marks on the chamfered part. SOLUTION: A wafer 1 is finished in a mirror surface at the marginal edge to form a chamfered part 2 having an engraved crystal orientation judging mark 3 or wafer identifying mark 4 formed by the laser marking as a hard or soft laser mark. The hard laser mark is formed by a high laser power into the chamfered surface and finishing in a mirror surface at a depth of 10μm or more. The soft laser mark is formed by a lower laser power at a depth of approximately 3μm or less into the chamfered mirror surface.