| 摘要 |
PROBLEM TO BE SOLVED: To effectively mount chips, even when the chip heights differ, by inserting adhesive between an electrode forming face of a substrate and chip electrode face, aligning the substrate electrodes with opposed chip electrodes and hot pressing them through a buffer layer over the backs of the chips. SOLUTION: With adhesives inserted between an electrode 5 forming face of a substrate 1 and electrodes 4 of chips 2, the substrate electrodes 5 are aligned with the electrodes 4 of the opposed chips 2 and hot pressed with a buffer layer 6 over the backs of the chips 2 in a conduction test step and hot pressing step. The electrodes 5 of the substrate 1 and electrodes 4 of the chips 2 are aligned, using an image recognizer, etc., the substrate 1 and chips 2 are temporarily fixed by adhesive 3, and the buffer layer 6 is inserted between the backs of the chips 2 and the press die 8 to heat and press. This can mount the chips 2 effectively, even when the chip heights differ.
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