METHOD FOR MOUNTING CHIP PARTS

摘要

PROBLEM TO BE SOLVED: To provide a method for mounting chip parts by which a power source can be stabilized by reducing the influence of the inductance of a line. SOLUTION: A semiconductor element 11 is mounted on a package substrate 12 and bump electrodes 17 are formed on the lead-out electrode 14 of the element 11 and a wiring electrode 15 on the substrate 12. The lower-surface electrode 16A of a both-surface electrode type chip capacitor 13 is connected to the bump electrodes 17 and the upper-surface electrode 16B of the capacitor 13 is connected to the lead-out electrode 14 of the element 11 and/or the wiring electrode 15 of the substrate 12 through bonding wires 18.