SEMICONDUCTOR MANUFACTURING METHOD AND APPARATUS THEREFOR

摘要

PROBLEM TO BE SOLVED: To accurately detect an alignment mark position, without being influences by ruggedness of resist or thin film on a semiconductor wafer surface or resist ununiformity. SOLUTION: An alignment mark is detected on a work 1 when the work 1 is positioned such that the autocorrelation operation is made in terms of the alignment mark width about a photographed alignment mark image signal to obtain the position coordinates of the mark from the signal waveform in the operation result. An alignment mark on a semiconductor wafer 1 is e.g. imaged by CCD cameras 9, 10 to obtain image signals thereof about which an autocorrelation processor then computes the autocorrelation in terms of the alignment mark width and a mark position processor computes the position coordinates of the alignment mark from the signal waveform obtd. in the autocorrelation operation result.