| 摘要 |
PURPOSE: To provide a mounting device which easily mounts a heat sink to a semiconductor element, can remove it without damage, and can reuse it. CONSTITUTION: A heat sink 1 is overlaid on a semiconductor element 3 and a buddr piece 11 provided at a mounting frame A is locked to both sides where the upper surface of the heat sink 1 opposes by utilizing the elastic deformation. Also, a lock part piece 10 provided at the mounting frame A is fed through and locked to a wiring substrate 2 where the semiconductor element 3 is assembled. |
