| 摘要 |
A test socket and a method for identifying a known good die using the test socket. The test socket includes a substrate having penetrating apertures, and land patterns formed around the penetrating apertures. The substrate has contact terminals at one side which are connected to the outside, and a protective casing is installed on the upper part of the substrate. After the semiconductor chips are mounted in the test socket by a piece of adhesive tape, to cover the penetrating apertures of the substrate, the bonding pads of the semiconductor chips and the land patterns of the substrate are connected to each other by wires. The test socket is then installed on a burn-in test board to carry out a burn-in test. The wires of the bare chips, which have been subjected to the burn-in test are cut by a cutting device, and a lower portion of each semiconductor chip corresponding to a known good die, is hit by an ejection pin through the penetrating apertures of the substrate to separate and obtain the known good dies. Accordingly, a plurality of known good dies may be obtained by carrying out one burn-in test. |
