| 摘要 |
PROBLEM TO BE SOLVED: To give the difference to the groove pitches of two group rollers, by keeping a specific relationship among the maximum pitch of a groove at a new wire supply side of each group roller, the minimum pitch of the groove formed at a wire recovering side, and the reduction of a diameter of a wire caused by abrasion when an ingot is sliced. SOLUTION: The grooves of specific depth are formed with a pitch (a) of, for example, 1.100mm on the wire supply side of the group rollers 1, 2, and with a pitch (b) of, for example, 1.095mm on the wire recovering side. A piano wire is used as the wire, and an ingot 9 is cut by a wire saw while reciprocating and running the wire between the group rollers 1, 2. During the cutting, the slurry is supplied to the wire. On this occasion, the pitches of the grooves formed on the group rollers 1, 2 are made large on the supply side, and small on the recovering side in anticipation of the reduction of the diameterΔd of the wire which is worn when the ingot 9 is sliced, that is, the relationship of b=a-Δis satisfied, whereby a wafer of small fluctuation of the thickness can be obtained. |
