| 摘要 |
<p>A substrate (1) for mounting a package has a core substrate (11) with a conductor pattern (16) and a surface layer (12) to cover the core substrate (11). The core substrate is constituted of a ceramic resin composite substrate or a substrate of low thermal expansion. The surface layer is made of glass resin composite material. The surface layer has connection holes (14) which reaches the conductor pattern (16) formed on the core substrate. In the internal of the connection holes, terminals (4) to be connected to the outside for electrically connecting the substrate (1) to a package are mounted. It would be allowed that the connection holes for connecting the terminals to be connected to the outside are formed in the surface layer and the conductor pattern is located at the bottom of the connection holes.</p> |
