发明名称 THERMALLY CONDUCTIVE FILM AND METHOD FOR THE PREPARATION THEREOF
摘要 <p>Thermally conductive interface materials comprise a matrix resin film filled with carbon fiber oriented transversely to the plane of the film and extending substantially through the film thickness to provide a high conductivity path between the adhered components. The interface materials may be particularly useful as thermally conductive adhesive films for bonding electronic components to the surfaces of heat sinks and thermal management devices.</p>
申请公布号 WO1998040431(A1) 申请公布日期 1998.09.17
申请号 US1998004720 申请日期 1998.03.10
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