Notch-free marked wafer production

摘要

Producing a notch-free wafer comprises: (a) milling a longitudinal notch (1) at a position on the crystal periphery corresponding to a predetermined crystal orientation, during grinding of the crystal periphery; (b) slicing the crystal into wafers;(c) laser engraving an orientation indicating marking (2) at a position corresponding to the bottom of the notch; and (d) removing the wafer edge, together with the notch, to produce a round wafer (7).