| 摘要 |
In an apparatus for mounting electronic components of the invention, a moving part is attached to a frame of the apparatus and moved freely in front and rear directions by a moving device. Also, first and second movable members are attached to the moving part and freely and independently moved in right and left directions by first and second moving members. First and second fitting heads are attached to the first and second movable members, and independently and freely moved between a supply section and a mounting section in the frame. When the electronic components are held at the first and second fitting heads, the first fitting head moves the electronic components from the supply section to mount onto a substrate in one mounting section, and the second head moves the electronic components from the supply section to mount on a substrate of a different mounting section in the apparatus.
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