| 摘要 |
A semiconductor package includes a semiconductor chip having a plurality of electrodes on a main surface thereof, and a package substrate having first and second parallel surfaces, wherein the package substrate is fixed to the semiconductor chip in such a positional relationship that the main surface of the semiconductor chip faces the first surface, and has substantially the same size as a size of the semiconductor chip as viewed on a projection plane vertical to the first surface, and wherein the package substrate has a passage extending between the first and the second surfaces for electrically connecting the electrodes of the semiconductor chip to predetermined portions of the circuit board. A method of mounting the above-mentioned semiconductor package to the circuit board comprises electrically connecting the electrodes of the semiconductor chip to predetermined portions of the circuit board by bonding wires or bumps, through the passage provided to the semiconductor package.
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