Printed circuit board layering configuration for very high bandwidth interconnect

摘要

A ground plane interconnection is provided on first and second substrates, the first and second substrates having respective first and second ground layers disposed on a first surface of each of the first and second substrates. A ground conductor strip is disposed on a second surface of the second substrate, wherein the ground conductor strip includes a plurality of electrically conductive members which pass through the second substrate to electrically couple the ground conductor strip and the second ground layer. The first substrate is positioned with respect to the second substrate such that when the first substrate is placed proximate the second substrate, the ground conductor strip electrically couples the first and second ground layers to form a continuous ground plane. A method of forming a reduced-inductance continuous ground plane is also provided.