发明名称 |
SUBSTRATE TREATING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treating device in which no atmospheric gas infiltrates a treating chamber and the space between a substrate and a transporting chamber. SOLUTION: A substrate housing chamber 40 housing a substrate holding section 62 which transports an untreated substrate and another substrate housing chamber 40b which houses another substrate holding section which transports a treated substrate are housed. Since an air inlet 34 and a air exit 35 are respectively formed through the top and bottom plates of the chamber 30, clean air flows downward in the chamber 30. In addition, a plurality of treating chambers 11 are arranged around the chamber 30 and an intermediate low-pressure section A is formed between the opening 16 of the treating chambers 11 and the substrate exists and entrances 41a and 41b of the substrate housing chambers 40a and 40b. The low-pressure section A is set at a pressure lower than those in the treating chambers 11 and substrate housing chamber 40a and 40b. |
申请公布号 |
JPH10247677(A) |
申请公布日期 |
1998.09.14 |
申请号 |
JP19970049442 |
申请日期 |
1997.03.04 |
申请人 |
DAINIPPON SCREEN MFG CO LTD |
发明人 |
KAMIYAMA TSUTOMU |
分类号 |
H01L21/677;B65G49/00;B65G49/06;B65G49/07;H01L21/02;H01L21/027;H01L21/205;H01L21/304;H01L21/68;(IPC1-7):H01L21/68 |
主分类号 |
H01L21/677 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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