发明名称 MANUFACTURE OF CASE FOR HOUSING ELECTRONIC EQUIPMENT OR THE LIKE
摘要 PROBLEM TO BE SOLVED: To make it unnecessary for the installation of an extra gasket material at the mating of the cases of an electronic equipment by a method wherein a gasket continuous to a mating surface is formed by injection-molding a thermoplastic elastomer in a cavity. SOLUTION: A gasket material is injection-molded on the front of the mating surface 2 of a cover 1. At the same time, on its rear side, an elastomer layer, which is made of the same material as the gasket material, is also injection- molded. Concretely, under the condition that the edge including the mating surface 2 of the cover 1 is positioned in a groove part, which is formed by the cavities 22 and 23 engraved in molds A and B, and a thermoplastic elastomer SEBS is injection-molded in the formed space 24. Accordingly, on the mating surface 2 of the cover 1, a gasket material made of SEBS is formed and, at the same time, also on the rear side of the mating surface 2, a SEBS elastomer layer is formed in the fashion for covering the edge of the cover 1. Since, the SEBS elastomer layer covering the edge connects with the gasket material on the front of the mating surface, no separation or the like develops.
申请公布号 JPH10244557(A) 申请公布日期 1998.09.14
申请号 JP19970065335 申请日期 1997.03.04
申请人 BRIDGESTONE KASEIHIN TOKYO KK 发明人 YASUI MANABU
分类号 H05K5/02;B29C45/14;B29K21/00;B29L22/00;(IPC1-7):B29C45/14 主分类号 H05K5/02
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