| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinding heat measuring method for a grinding device which grinds the one surface of those plate like objects such as silicone wafers and glass panes and accurately measures the temperature of the grinding contact surfaces. SOLUTION: When a lower support member 11 and an upper support member 31 are closed relatively to each other, and a rotating grinding body 23 and holding carrier 38 grind an object to be ground 55 which is held by the holding carrier 38 installed on the other support member 31, the actual grinding heat of the grinding body 23 at the grinding contact surface between the object to be ground 55 and the grinding body 23 is measured real by a measuring device 44, and the speed of the grinding body 23 can be increased until the measured value, i.e., the measured temperature reaches a limit temperature. |
