| 摘要 |
<p>PROBLEM TO BE SOLVED: To realize a lift pin guidance apparatus which is capable of accurately guiding a lift pin uniformly applying a force to it by a method wherein a lift pin which is for lifting a wafer from the surface of a pedestal in a semiconductor wafer processing system and guided by a guide bushing and a guide pin is provided. SOLUTION: A pedestal sub-system 120 is provided with lift pin holes 116 and supports a wafer 102 with the surface of a pedestal 104. A lift mechanism lifts down or up a pedestal lift 112 in a vertical direction regulating the pedestal. The extension/retraction mechanism of a lift pin assembly 130 is driven by an actuator 114 and guided by a guide pin 110. The lift pin and the guide pin 110 are slidably engaged with each other and kept fixed to the pedestal 104 and a lift pin 116. It is preferable that the lift pin 108 is a hollow body equipped with a solid chip at its top. A lift pin can be accurately guided without causing damage to a wafer.</p> |
