发明名称 |
DEVICE AND METHOD OF LASER BEAM MACHINING FOR TRANSPARENT HARD BRITTLE MATERIAL |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a device and method of laser beam machining for a transparent hard brittle material, using thermal stress produced by laser beam irradiation, the device and method that are capable of suppressing waviness in a cut section in case of using a highly absorptive laser beam and that are capable of improving workability in the case of using a highly transmissive laser beam. SOLUTION: A semi-transparent mirror 6 and a reflection mirror 7 are installed in a manner of holding a transparent hard brittle material in between 4 which is an object to be machined. The semi-transparent mirror 6 is one that totally reflects a laser beam 2 from the side of the transparent hard brittle material 4 and that transmits the laser beam from the opposite side, while the reflection mirror 7 is one that totally reflects the laser beam 2. Machining is performed by transmitting the laser beam 2 through the transparent hard brittle material 4 while the laser beam is repeatedly reflected between the semi-transparent mirror 6 and the reflection mirror 7.</p> |
申请公布号 |
JPH10244386(A) |
申请公布日期 |
1998.09.14 |
申请号 |
JP19970047677 |
申请日期 |
1997.03.03 |
申请人 |
HITACHI CONSTR MACH CO LTD |
发明人 |
MITSUYANAGI NAOKI;SHIMOMURA YOSHIAKI;OKUMURA SHINYA;SAKURAI SHIGEYUKI;NISHIGAKI TAKESHI;MINOMOTO YASUSHI |
分类号 |
G02F1/13;B23K26/00;B23K26/06;B23K26/40;C03B33/09;(IPC1-7):B23K26/00 |
主分类号 |
G02F1/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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