发明名称 DEVICE AND METHOD OF LASER BEAM MACHINING FOR TRANSPARENT HARD BRITTLE MATERIAL
摘要 <p>PROBLEM TO BE SOLVED: To provide a device and method of laser beam machining for a transparent hard brittle material, using thermal stress produced by laser beam irradiation, the device and method that are capable of suppressing waviness in a cut section in case of using a highly absorptive laser beam and that are capable of improving workability in the case of using a highly transmissive laser beam. SOLUTION: A semi-transparent mirror 6 and a reflection mirror 7 are installed in a manner of holding a transparent hard brittle material in between 4 which is an object to be machined. The semi-transparent mirror 6 is one that totally reflects a laser beam 2 from the side of the transparent hard brittle material 4 and that transmits the laser beam from the opposite side, while the reflection mirror 7 is one that totally reflects the laser beam 2. Machining is performed by transmitting the laser beam 2 through the transparent hard brittle material 4 while the laser beam is repeatedly reflected between the semi-transparent mirror 6 and the reflection mirror 7.</p>
申请公布号 JPH10244386(A) 申请公布日期 1998.09.14
申请号 JP19970047677 申请日期 1997.03.03
申请人 HITACHI CONSTR MACH CO LTD 发明人 MITSUYANAGI NAOKI;SHIMOMURA YOSHIAKI;OKUMURA SHINYA;SAKURAI SHIGEYUKI;NISHIGAKI TAKESHI;MINOMOTO YASUSHI
分类号 G02F1/13;B23K26/00;B23K26/06;B23K26/40;C03B33/09;(IPC1-7):B23K26/00 主分类号 G02F1/13
代理机构 代理人
主权项
地址