| 摘要 |
PROBLEM TO BE SOLVED: To increase the pressing quantity of a pressing ball preventing an IC chip body from cracking, and to increase the joining strength between an Al electrode and the pressing ball by performing primary pressing in a region other than the Al electrode on the upper surface of the IC chip, and then performing secondary pressing to the Al electrode on the IC chip. SOLUTION: On the occasion of connecting an Al electrode 5 on an IC chip 6 to an external terminal, a ball is pressed against the Al electrode 5. In that case, primary pressing of a ball 3 is performed by causing a capillary 2 to descent to a region 9 other than the Al electrode 5 on the upper surface of the IC chip 6, after the ball 3 is formed at the tip of a wire 2 inserted into the capillary 2. Next, the ball 3a primarily-pressed and the capillary 2 are raised, and then the capillary 2 is caused to descend to the Al electrode 5 on the IC chip 6, and secondary pressing for joining pressing ball 3b is performed. The ball 3 formed using a discharge torch 4 for example is primarily pressed against nonwired spots in the pattern section of the IC chip 6 and the nonpatterned section. |
