| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method and apparatus for peeling a protective sheet from a semiconductor substrate whereby the sheet diced into pieces on the substrate is easily removed en bloc. SOLUTION: A protective sheet peeler has a controller which control the drive of X-, Y-, Z-axis linear actuators and rotary actuator to scan a heater 13A contacted to a protective sheet diced into pieces along sections Lx of the cut pieces on a wafer 1 and a similarly constituted heater along sections Ly to integrally weld the sheet 3 to the wafer 1, and then peels it from the wafer en bloc; the heaters having comb teeth arranged at equal pitches to those of the sections Lx, Ly.</p> |
