BARE CHIP PACKAGE, SEMICONDUCTOR CONNECTING BOARD AND SEMICONDUCTOR CHIP TESTING METHOD

摘要

PROBLEM TO BE SOLVED: To easily judge whether a bare chip is good or not. SOLUTION: A substrate 11 to be a base of a semiconductor substrate 10 has holes piercing its thickness, a conductive material 12a-12g filled in the holes, and metal bumps disposed at the top and bottom of the material 12a-12g. Metal bumps 13a-13g for connecting a bare chip 20 are provided at the top surface and connected to electrode terminals of this chip 20. On the contrary, metal bumps 14a-14g on the bottom surface are to connect the semiconductor connecting substrate 10 to a printed circuit board. Testing pads 15a, 15b are disposed on the top surface of the substrate 11 and electrically connected to corresponding metal bumps through wirings 16a, 16b.