MANUFACTURE FOR SEMICONDUCTOR INTEGRATED CIRCUIT

摘要

PROBLEM TO BE SOLVED: To improve quality of an inspection and a review in manufacturing of a semiconductor integrated circuit. SOLUTION: A lower pattern 2 is formed on a silicon substrate or an undercoat substrate 1 having several layers formed on the silicon substrate. At this time, a material absorbing a light of a wavelength used at an inspection or review is used for a layer 3 of an oxide film or the like to be formed on the substrate so as not to pass the light of the wavelength of the inspection or review.