| 摘要 |
PROBLEM TO BE SOLVED: To provide a rinsing solution composition for stripping treatment and the method for treating the substrate by using it each being capable of well rinsing the minute parts of the substrate and not corroding the thin films of Al, Al-Si, Al-Si-Cu and the like by incorporating a lower alkylene glycol and another water-soluble organic solvent. SOLUTION: This rinsing solution composition is the stripping solution for the substrate, for semiconductor elements and liquid crystal panel elements, which has been treated with the stripping solution composed essentially of a base salt and containing no hydrofluoric acid and no metal ion and the composition contains lower alkylene glycol and another water-soluble organic solvent, and this glycol is represented by Rn(OH)2 in which R is a straight or branched saturated hydro-carbon group and (n) is an integer of 2-6, and it is embodied by ethylene glycol, propylene glycol, trimethylene glycol, 1,2-butylene glycol, 2,3-butylene glycol, and the like. |
